|
|
| Process |
Environment |
Capacity |
Capability |
| Wafer Grinding |
Class 1000 |
28 (Kpcs/M) |
4~12” wafer
● Mass production ： grind to 50um
● Engineering ： grind to 20um |
| Wafer Dicing |
Class 1000 |
70 (KKea/M) |
4~12” wafer
● Die size scale 25.5 : 1
● Scribe line under 36um for mass production. |
| Chip Pick & Place |
Class 100 |
50 (KKea/M) |
● Die size scale 25.5 : 1 for mass production. |
|
About Tester
