KEY FEATURES
- Able to connect to the test system (optional: customized)
- With 6S Fail recycle waffle tray (2”)
| 規格 | |
|---|---|
| Wafer 晶圓尺寸 | 8”、12” |
| Chip Size(mm) 晶粒尺寸 | 0.5mm＊0.5mm~8mm＊8mm |
| Chip Thickness 晶粒厚度 | 0.1mm~1.5mm |
| Accuracy 置晶精度 | XY≦±25μm, θ≦±1° |
| Pick and Place Force 挑檢手臂克重 | 30g~80g |
| Tape Reel 收料載具型式 | 7” & 13” Reel |
| 55 Inspection 檢測能力 | Resolution 10um(Minimum) |
| Loading/Unloading 載入/載出 | Automatic |
| Static Protection 靜電防護 | 100mm, ±1000V~±100V＜5sec |
| Compressed Air 壓縮空氣 | 5 kg/cm2 |
| Vacuum 真空 | >0.9 kg/cm |
| Power 電壓 | 220 VAC /Single Phase, 6A(Operation), 8A(Peak), 50/60 Hz |
| Power 功率 | 3000W |
| Weight 重量 | 1250kg |
| Dimension( W*D*H) 尺寸 | 1800＊2600＊1750(mm) (without tower light) |