DB157 ｜ LED Bonder ｜ LED

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About YTEC
Products
Services
Investors
CSR
News Join Us
Customer Services
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Company Profile
Business Philosophy
Organization
Management Team
Milestone
Policy and Certification
TPEx information platform
Semiconductor
LED
RFID
Mini LED
Semiconductor OEM Service
LED OEM Service
RFID OEM Service
Investors Financials
Corporate Governance
Shareholders
Sustainable Operation Policy
Corporate Social Responsibility
Stakeholder Communication
Environmental Protection
Happy Workplace
Frequently Asked Questions
Sustainable Supply Chain Management
CSR Report Download
E-Learning
Customer Service
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Multiple applications LED Die Bonder

DB157

Information Request
DB157
DB157

Features

 
  • Applicable Backlight Bonding
  • Lateral CCD dispensing monitoring
  • Customizable functional requirements

Specification

 
  • Wafer Ring Size: 6”
  • Chip size: 6~40mil
  • Accuracy: ±38um (X、Y)、±3˚ (θ)
  • Work Table: 600*120mm


 
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