RFID Dry Inlay Bonder ｜ RFID

YTEC’s high-efficiency wide-web RFID dry inlay bonder is designed for high-speed RFID inlay production, achieving UPH 30K with a single wafer. Optimized for small-sized chips, the system supports wide-web and multi-lane production with integrated die bonding, testing, slitting, and rewinding for stable and efficient RFID inlay manufacturing.

The FR30M, YTEC's next-generation RFID Dry Inlay Bonder, embodies our brand's legacy of 30 years of equipment development and integrated system design capability, which we leverage to bring to IoT market.