Features
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High Throughput: Achieves UPH 30K with just one wafer, specifically designed for small-sized chips.
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Intelligent Process: Equipped with a multiple pick-and-place die bonding system with automatic chip position correction.
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Real-Time Monitoring: Continuously monitors adhesive dispensing and die bonding, with built-in adhesive volume inspection and yield statistics.
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Automatic Recovery: Automatically re-picks missed chips to improve picking yield and minimize chip loss.
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Flexible Thermocompression: Thermocompression heads support fast-curing adhesive processes, with independent control for each working zone.
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Quality Assurance: Automatic visual inspection after curing, with thermal-transfer technology available for defective product marking.
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Modular Design: Flexible test module configuration supporting both movable and fixed testing solutions.
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Smart Management: Software automatically calculates web length for easier production tracking and management.
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Stable & Reliable: Fully automated process design reduces human error and ensures stable operation over extended production runs.
Specifications
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Die Bonding Throughput: 30,000 units/hour
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Dual-Machine Throughput: 60,000 units/hour
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Die Bonding Accuracy: ± 30μm
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Angular Accuracy: ± 2°
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Thermocompression Temperature: Room temperature to 300 ± 5°C
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Supported Web Width: 100–385 mm
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Supports multi-lane production, testing, slitting, and rewinding